•Intel LGA 1700 socket: Ready for 12th and 13th Gen Intel processors
•Enhanced power solution: 14+1 DrMOS, 6-layer PCB, ProCool connectors, alloy chokes and durable capacitors for stable power delivery
•Next-gen connectivity: Intel Wi-Fi 6, PCIe 5.0, Realtek 2.5Gb Ethernet, USB 3.2 Gen2x2 Type-C, front panel USB 3.2 Gen 2 Type-C, Thunderbolt (USB4) header support, 3 PCIe 4.0 M.2
•ASUS OptiMem II: Careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking
•Comprehensive cooling: Large VRM heatsinks, flexible M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 4 with AI Cooling II