SKU: 3177Specifications:Refrigeration principle: semiconductor refrigeration + fan coolingPower supply type: plugin modeMaterial: ABS + Zinc AlloyCooling area: 30 square centimetersCooling method: semiconductor + wind power coolingBack clip design, the widest can be clipped 88cmFeatures:Exquisite and lightweightSmooth operation without blocking your handsNew mobile phone cooling essentialsNot high, not lowJust control the required temperatureIntelligent temperature control black technologyInstantly reduce the temperatureMultiple cooling channelsBlack