Ultra Thin Pure Copper Heat Sink Back Memory Card HeatSink Cooling Pad For MOS IC Chip

Ultra Thin Pure Copper Heat Sink Back Memory Card HeatSink Cooling Pad For MOS IC Chip Description: Features: brand new and high quality. Small size and light weight, easy to install and use. Dissipates the heat improve its performance. Adhesive tape with high thermal conductivity. Suitable for motherboard DDR VGA memory chipset IC Specifications Item Type: Copper Heat Sink Material: Pure Copper Color: Size 19×9×2mm/0.75×0.35×0.08in (approx.) Quantity: 1 PC (other accessories demo in the picture is not included) Note: 1.Transition: 1cm=10mm=0.39inch 2.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid. 3.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you! Package includes: retail package) 1 X Copper Heat Sink