Product description
-559-ASM for BGA flux solder paste flux 100g flux
High-viscosity no-clean flux can be used for rework, fixing balls or pins to for BGA, CGA and CSP packages and assembly operations.
For example, the flip chip is fixed on the PWB substrate, and the good formula of for BGA ball/ball can make the ball adhere more.
1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
2. Please allow slight manual measurement deviation for the data.