Product description
Material: Rosin Soldering Paste
Type: Rosin-based Soldering Flux Paste
Model Number: Welding Flux
Application: for Phone Motherboard BGA Soldering Repair
Function: for Phone PCB, PC Cards, PGA, SMD Rework
Suitable for: for Phone PC Cards and Other Sophisticated Electronic Chip-level Flux Welding
Shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth. For mobile phones, PC cards and other sophisticated electronic chip-level flux welding.