Product Description:
brand new high quality
Made of high quality material,
Pad Rework-Mobile Phone IC Spot Soldering-Touch for BGA-PCB Pad.
Flying wire supplementary spot welding sheet mobile phone maintenance motherboard flying wire pasting pad drop point traceless repair without circle.
Just peel off the protective layer, it can be used and repaired.
The for pads are reinforced with retaining pins and will never fall off.
Improve maintenance efficiency, achieve the pad effect& seamless.
The flatness is good, which can effectively prevent the virtual welding caused by unevenness.
Material: Copper wire+ PC plastic plate
Size: approx. 4.8x5.8 cm/2x2.3 inches
1 Pc equals or exceeds 100 solder points of different shapes.
Package Included:
1* Solder tab
Note:
1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
2.Please allow slight manual measurement deviation for the data.