Product description
*Repair tin pad, mobile phone chip tin implant.
*Magnetic positioning, steel mesh magnetic leveling, freeing your hands; scraping tin does not move, more even. With our single magnet base, it is easier and more convenient to install tin, and it is not easy to bulge.
*Innovative slope design allows the chip to fit more closely, is compatible with thinner chip ICs, and the for pads are not suspended and are more uniform.
*Good compatibility, suitable for chips withthick below 0 and 9mm, suitable for auxiliary tin implantation of most current mobile phone chips.
1. Transition: 1cm=10mm=0.39inch.
2. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
3. Please allow slight manual measurement deviation for the data.