CPU Chip Heat Insulation Pad Easy to Use Non Slip IC Silicone Repair Pad

【Material】: The phone repair pad is made of silicone material, is wear resistant and long service time 【Size】:The IC silicone repair pad size is 12.5 cm x 12.5 cm/4.92 inch x 4.92 inch 【Directly Replace】: Directly replace the old or broken CPU chip heat insulation pad 【Easy To Use】: The repair pad is easy to use and do not require complex steps to use 【High Performance】: CPU chip heat insulation pad high temperature resistance, non slip, not easily deformed, thickness of about 4.8mm

Specification:

Material: Silicone

Size Chart:

12.5 cm x 12.5 cm/4.92 inch x 4.92 inch Thickness: 0.48cm/0.19inch

Package Includes:

1x Phone Repair Pad

Note: